On Wednesday, MGIC Investment Corp. (NYSE:MTG)’s shares inclined 0.46% to $11.01.
MGIC Investment Corp. (MTG) continued its streak of strong operating statistics, seen over several months, in May 2015. The trend reflects a decline in the delinquency level and an improvement in new business written.
Primary new insurance written for May 2015 was $3.7 billion, up 32% year over year and 2.8% sequentially.
Delinquency loans (loans that failed to pay back) at MGIC Investment witnessed an improvement on a year-over-year basis. Delinquent inventory for the month under review was 68,224, down 21% year over year and 2% sequentially.
Established in 1957, MGIC Investment is the nation’s oldest private mortgage insurer, with insurance in force of $164.9 billion.
The company which was devastated by the 2008 financial crisis is crawling back. Its fortunes have been shored up by declining delinquencies and improving cure rates on claims from its legacy business. The prospects of the company also look bright on its growing book of high-credit-quality business written since 2009.
MGIC Investment Corporation, through its auxiliaries, provides private mortgage insurance and ancillary services to lenders and government sponsored entities in the United States. The company offers primary mortgage insurance that provides mortgage default protection on individual loans, in addition to covers unpaid loan principal, delinquent interest, and various expenses associated with the default and subsequent foreclosure; and pool insurance coverage, which covers the excess of the loss on a defaulted mortgage loan that exceeds the claim payment under the primary coverage.
Siliconware Precision Industries (ADR) (NASDAQ:SPIL)’s shares dropped -9.61% to $5.27.
Siliconware Precision Industries Co., Ltd. (“SPIL” or the “Company”) (Taiwan Stock Exchange: 2325, NASDAQ: SPIL) recently declared that its merged sales revenues for the second quarter of 2015 were NT$ 21,240 million, which represented a 2.1% growth in revenues contrast to the first quarter of 2015 and a 3.1% decline in revenues contrast to the second quarter of 2014. SPIL stated a net income of NT$ 3,677 million for the second quarter of 2015, contrast with a net income of NT$ 2,615 million and a net income of NT$ 3,375 million for the first quarter of 2015 and the second quarter of 2014, respectively.
Basic earnings per share for this quarter was NT$ 1.18, and diluted earnings per ordinary share was NT$ 0.93. Basic earnings per ADS for this quarter was US$ 0.19, and diluted earnings per ADS was US$ 0.15.
Siliconware Precision Industries Co., Ltd. provides semiconductor packaging and testing services to semiconductor suppliers worldwide. Its packaging and testing solutions comprise advanced packages, substrate packages, and lead-frame packages, in addition to testing for logic and mixed signal devices to measure and ensure the performance, functionality, and reliability of packaged semiconductor devices.
At the end of Wednesday’s trade, Biogen Inc (NASDAQ:BIIB)‘s shares dipped -2.06% to $313.34.
A chronic disease like relapsing MS (RMS) can complicate common aspects of everyday life, and a new program from Biogen (BIIB) and SELF is helping women navigate these familiar issues. Reimagine MySelf, which is now available on SELF.com, provides women access to editorial content and an exclusive blog series where writers from the SELF Made Blogger Collective and experts offer their best practical advice on style, entertaining, travel, healthy eating and more. Personal tips for women living with RMS are incorporated into all of the blogs to ensure their relevance and meaning for those facing an RMS diagnosis.
Biogen Inc. discovers, develops, manufactures, and markets therapies for the treatment of neurological, autoimmune, and hematologic disorders in the United States and internationally. It provides AVONEX to treat relapsing multiple sclerosis (MS); TYSABRI to treat relapsing forms of MS and Crohn’s disease; PLEGRIDY to treat relapsing MS; TECFIDERA to treat MS; FAMPYRA to improve walking in adult patients with MS; ALPROLIX to treat hemophilia B; ELOCTATE to treat hemophilia A; RITUXAN for treating non-Hodgkin’s lymphoma, rheumatoid arthritis, and chronic lymphocytic leukemia (CLL), in addition to two forms of ANCA-associated vasculitis; GAZYVA for the treatment of patients with formerly untreated CLL; and FUMADERM to treat severe plaque psoriasis in adult patients.
Advanced Semiconductor Engineering (ADR) (NYSE:ASX), ended its Wednesday’s trading session with -8.09% loss, and closed at $5.28.
Advanced Semiconductor Engineering, Inc. (TASX) the world’s largest independent provider of packaging and testing services, recently stated unaudited net revenues[1] of NT$70,222 million for the second quarter of 2015 (2Q15), up by 20% year-over-year and up by 9% sequentially. Net income attributable to shareholders of the parent for the quarter totaled NT$3,652 million, down from a net income attributable to shareholders of the parent of NT$5,106 million in 2Q14 and down from a net income attributable to shareholders of the parent of NT$4,469 million in 1Q15. Basic earnings per share for the quarter were NT$0.48 (or US$0.077 per ADS), contrast to basic earnings per share of NT$0.66 for 2Q14 and NT$0.58 for 1Q15. Diluted earnings per share for the quarter were NT$0.43 (or US$0.070 per ADS), contrast to diluted earnings per share of NT$0.65 for 2Q14 and NT$0.56 for 1Q15.
Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services (EMS) segments. The Packaging segment offers packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, and IC wirebonding packages, counting lead frame-based package types, such as quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, and advanced QFN; 3D chip packages; stacked die solutions in various package types, such as stacked die quad flat no-lead, hybrid BGAs containing stacked wire bond, and fc die; and copper wire and silver bonding solutions, in addition to module assembly services, and interconnect materials.
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