During Wednesday’s Morning trade, Shares of Texas Instruments Incorporated (NASDAQ:TXN), gained 0.46% to $57.32.
Texas Instruments, declared the availability of the next device in the Simple Link™ ultra-low power platform, designed to assist customers easily add ultra-low power, long-range connectivity to their Internet of Things (IoT) designs. The new Simple Link Sub-1 GHz CC1310 wireless microcontrollers (MCUs) offers up to 20 years of battery life for building and factory automation, alarm and security, smart grid and wireless sensor network applications.
Designed for ultra-low power, long-range applications, the CC1310 wireless MCUs feature:
- Extended battery life with an ultra-low power radio, integrated ARM® Cortex®-M3 MCU, sensor controller, low-power modes and 0.6 µA sleep current, in addition to a top ULPBench™ score of 158
- Longer range with great sensitivity and strong coexistence that spans full-buildings to city-wide coverage for over 20 km on a coin cell battery
- Improved integration in a fingertip size wireless MCU that provides a small footprint with more possibilities in a single-chip, Flash-based, 4X4 QFN for your coin-cell application
TI has simplified development with the Simple Link CC1310 wireless MCUs by providing software options to fit a developer’s needs. The software available recently comprises point-to-point communication examples with Easy Link and a wM-Bus protocol stack leveraging TI RTOS, in addition to a Contiki 6LoWPAN mesh networking stack. Developers will also have access to development tools, reference designs, online training and E2E™ community support to assist ease their design process. Additionally, TI offers scalable memory to fit developer’s code size with 32kB, 64kB, or 128kB Flash.
Texas Instruments Incorporated designs, manufactures, and sells semiconductors to electronics designers and manufacturers worldwide. It operates through two segments, Analog and Embedded Processing. The Analog segment offers high volume analog and logic products for automotive safety devices, touch screen controllers, low voltage motor drivers, and integrated motor controllers; and power administration products to enhance the efficiency of powered devices using battery administration solutions, portable power conversion devices, power supply controls, and point-of-load products.
Shares of The Chemours Company (NYSE:CC), inclined 3.19% to $5.80, during its current trading session.
The Chemours Company (“Chemours”) (CC), declared that, together with its partner Changshu 3F Zhonghao, it has broken ground on the world’s first full-scale production facility for HFO-1336mzz in Changshu, Jiangsu Province, China. This site, predictable to start production mid-year 2017, will provide raised capacity of low global warming potential (GWP) foam expansion agents and refrigerants.
Foam expansion agents based on HFO-1336mzz, sold by Chemours as Formacel™ 1100, offer excellent environmental properties across a variety of applications, counting appliances, spray foam and board stock. Formacel™ 1100 offers a range of benefits to assist Chemours customers meet their long-term environmental needs. In addition to its zero ozone depletion potential (ODP) and an extremely low global warming potential (GWP) of less than two, this product can further reduce energy consumption and greenhouse gas emissions with better thermal insulation performance than incumbent products. Formacel™ 1100 also offers superior stability contrast to other olefin-based blowing agents, and its shelf life of up to 12 months allows customers to use the product with confidence over an extended period.
HFO-1336mzz is a preferred technology for many Opteon™ refrigerants due to its unique attributes of having low GWP, non-flammability, high efficiency and thermal stability. Chemours is actively developing several new refrigerant fluids based on HFO-1336mzz technology for a variety of applications, counting traditional chiller systems and the emerging arena of waste heat recovery using technologies such as high temperature heat pumps and organic rankine cycles. These fluids are showing promising results in customer lab and field trials.
The Chemours Company, a chemical company, provides titanium technologies, fluoroproducts, and chemical solutions. Its flagship products comprise brands, such as Teflon, Ti-Pure, Krytox Viton, Opteon, and Nafion. The company produces titanium dioxide, with Ti-Pure for coatings, plastics, laminates, and paper; and fluoroproducts, counting Teflon fluoropolymers, Krytox performance lubricants, Viton fluoroelastomers, and Opteon refrigerants. In addition, it offers chemical products, counting sulfuric acid, cyanide for gold processing, chlorine dioxide for water treatment, and Virkon disinfectant technologies for biosecurity.
Finally, Shares of Advanced Micro Devices, Inc. (NASDAQ:AMD), gained 1.77%, and is now trading at $2.02.
Building on its planned investments in heterogeneous system architecture, declared a suite of tools designed to ease development of high-performance, energy efficient heterogeneous computing systems. The “Boltzmann Initiative” leverages HSA’s ability to harness both central processing units (CPU) and AMD FirePro™ graphics processing units (GPU) for maximum compute efficiency through software. The first results of the initiative are featured this week at SC15 and comprise the Heterogeneous Compute Compiler (HCC); a headless Linux® driver and HSA runtime infrastructure for cluster-class, High Performance Computing (HPC); and the Heterogeneous-compute Interface for Portability (HIP) tool for porting CUDA-based applications to a common C++ programming model. The tools are designed to drive application performance across markets ranging from machine learning to molecular dynamics, and from oil and gas to visual effects and computer-generated imaging.
“AMD’s Heterogeneous-compute Interface for Portability enables performance portability for the HPC community. The ability to take code that was written for one architecture and transfer it to another architecture without a negative impact on performance is extremely powerful,” said Jim Belak, co-lead of the U.S. Department of Energy’s Exascale Co-design Center in Extreme Materials and senior computational materials scientist at Lawrence Livermore National Laboratory. “The work AMD is doing to produce a high-performance compiler that sits below high-level programming models enables researchers to concentrate on solving problems and publishing groundbreaking research rather than worrying about hardware-specific optimizations.”
Advanced Micro Devices, Inc. operates as a semiconductor company worldwide. The company’s products primarily comprise x86 microprocessors as an accelerated processing unit (APU), chipsets, discrete graphics processing units (GPUs), and semi-custom System-on-Chip (SoC) products.