On Thursday, Shares of TriNet Group Inc (NYSE:TNET), gained 0.84% to $16.85.
A new, best-in-class version of the TriNet Expense mobile expense reporting application was released by TriNet (NYSE:TNET), a leading cloud-based provider of HR solutions. The app brings advanced and highly demanded expense-reporting features into its easy-to-use mobile app.
The improvements in ease and efficiency made to the TriNet Expense mobile app follow a recent TriNet survey that found cumbersome expense-reporting procedures might burden employees’ personal finances, reduce professional opportunities, and even make employees more likely to look for a new job.
Key new features to the app were developed based on user feedback and designed to make the expense reporting process faster and more flexible for business travelers, while maximizing accuracy and efficiency for company administrators.
TriNet Group, Inc. provides human resources solutions for small and medium-sized businesses in the United States and Canada. The company offers payroll processing, human capital consulting, and employment law compliance services, in addition to health insurance, retirement plans, and workers compensation insurance services.
At the end of Thursday’s trade, Shares of Axovant Sciences Ltd (NYSE:AXON), gained 1.52% to $13.39.
Axovant Sciences Ltd., declared forthcoming presentations at three investor conferences:
- Wednesday, September 9 at 4:55 PM at the Baird 2015 Healthcare Conference in New York at the New York Palace hotel
- Thursday, September 10 at 2:00 PM at the BioCentury NewsMakers Conference in New York at the Millennium Broadway Hotel & Conference Center
- Thursday, September 17 at 9:30 AM at the Credit Suisse SMID Conference in New York at the Waldorf Astoria New York
Axovant’s administration team will present an overview of the company and its lead product candidate, RVT-101, which is predictable to enter a confirmatory phase 3 trial for the treatment of mild-to-moderate Alzheimer’s disease in the fourth calendar quarter of 2015.
Axovant Sciences Ltd., a clinical-stage biopharmaceutical company, focuses on the acquisition, development, and commercialization of therapeutics for the treatment of neurodegenerative disorders.
Finally, Tessera Technologies, Inc. (NASDAQ:TSRA), ended its last trade with 1.58% gain, and closed at $33.46.
Tessera Technologies, declared the acquisition of Ziptronix, Inc. for $39 million in cash. The acquisition expands on Tessera’s existing advanced packaging capabilities by adding a low-temperature wafer bonding technology platform that will accelerate delivery of 2.5D and 3D-IC solutions to semiconductor industry customers.
Ziptronix’s patented ZiBond direct bonding and DBI hybrid bonding technologies deliver scalable, low total cost-of-ownership manufacturing solutions for 3D stacking. Ziptronix’s intellectual property has been licensed to Sony Corporation for volume production of CMOS image sensors – an estimated $8.3 billion market according to Gartner. Ziptronix’s technology is also relevant to next-generation stacked memory, 2.5D FPGAs, RF Front-End and MEMS devices, among other semiconductor applications. Inclusive of CMOS image sensors, Tessera anticipates the annual market size to which this technology applies to exceed $15 billion by 2019.
“With this acquisition we’re gaining best-in-class technology, along with exceptional people, know-how in the 3D-IC market and a noteworthy patent portfolio,” stated Tom Lacey, CEO of Tessera. “With the escalating cost for each node of semiconductor lithography, it remains very clear to us that our R&D spend on semiconductor packaging will only become more important and valuable to our customers. Ziptronix has commercially licensed the ZiBond and DBI technologies and they stack up very well alongside our extensive portfolio of 2.5D and 3D intellectual property. I’m confident that aligning our respective capabilities with our development expertise will assist create a multi-hundred million dollar revenue opportunity for Tessera over the next decade as the industry continues to shift toward 3D-IC architectures.”
Tessera Technologies, Inc., through its auxiliaries, develops, licenses, and delivers semiconductor packaging and interconnect solutions; and products and solutions in the United States, Europe, and internationally.
DISCLAIMER:
This article is published by www.wsnewspublishers.com. The Content included in this article is just for informational purposes only. All information used in this article is believed to be from reliable sources, but we make no representations or warranties of any kind, express or implied, about the completeness, accuracy, or reliability with respect to this article.
All visitors are advised to conduct their own independent research into individual stocks before making a purchase decision.
Information contained in this article contains forward-looking information within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934, counting statements regarding the predictable continual growth of the market for the corporation’s products, the corporation’s ability to fund its capital requirement in the near term and in the long term; pricing pressures; etc.
Any statements that express or involve discussions with respect to predictions, expectations, beliefs, plans, projections, objectives, aims, assumptions, or future events or performance may be forward looking statements. Forward-looking statements are based on expectations, estimates, and projections at the time the statements are made that involve a number of risks and uncertainties which could cause actual results or events to differ materially from those presently anticipated. Forward looking statements may be identified through the use of such words as expects, will, anticipates, estimates, believes, or by statements indicating certain actions may, could, should might occur.
