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Saturday 11 April 2015
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Plummeters of Yesterday: Discover Financial Services (DFS), International Paper (IP), United States Steel (X), Taiwan Semiconductor Mfg. (TSM)

On Monday, Discover Financial Services (NYSE:DFS)’s shares dwindled -0.69%, and closed at $57.80, as Discover Financial Services programs to report its first quarter 2015 results following the market closes on Tuesday, April 21, 2015. The earnings release will be available on Discover’s corporate website at www.investorrelations.discoverfinancial.com.

A conference call to discuss the firm’s results, outlook and related matters will be held at 4:00 p.m. Central time.

Discover Financial Services works as a direct banking and payment services company in the United States. It operates in two segments, Direct Banking and Payment Services. The Direct Banking segment offers Discover-branded credit cards to individuals; and other consumer products and services, including private student loans, personal loans, home loans, home equity loans, prepaid cards, and other consumer lending, as well as deposit products, such as certificates of deposit, money market accounts, savings accounts, checking accounts, and individual retirement arrangement certificates of deposit.

International Paper Co (NYSE:IP), declined -0.66%, and closed at $54.31.

On April 2, 2015 International Paper will release first-quarter 2015 earnings on Wednesday, April 29, 2015 prior to the opening of the New York Stock Exchange.

The corporation will host a webcast to talk about earnings and current market conditions, starting at 9 a.m. ET (8 a.m. CT).

International Paper Corporation works as a paper and packaging corporation in North America, Europe, Latin America, Russia, Asia, Africa, and the Middle East. The corporation operates through three segments: Industrial Packaging, Printing Papers, and Consumer Packaging.

At the end of Monday’s trade, United States Steel Corporation (NYSE:X), dipped -0.65%, and closed at $24.50.

United States Steel Corporation President and CEO Mario Longhi joined fellow steel industry leaders in pressing Congress to strengthen America’s economic and national security by halting unfair trade practices and enforcing the country’s trade laws.

The prepared text of Longhi’s follows:

Good morning, Mr. Chairman and Members of the Steel Caucus. Thank you for the opportunity to testify recently and for your support over the years.

I am Mario Longhi, and I am proud to serve as the President and Chief Executive Officer of United States Steel Corporation, the largest integrated, American-headquartered manufacturer of steel.

America’s national security is a product of our unrivaled military, our extraordinary economic prowess, and the strength and unique resilience of the American people.

United States Steel Corporation produces and sells flat-rolled and tubular steel products in North America and Europe. It operates through three segments: Flat-Rolled Products (Flat-Rolled), U. S. Steel Europe (USSE), and Tubular Products (Tubular).

Taiwan Semiconductor Mfg. Co. Ltd. (ADR) (NYSE:TSM), dropped -0.63%, and closed at $23.54.

Altera Corporation and declared the two companies have produced an innovative, UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology that provides improved quality, reliability and integration for Altera’s MAX® 10 FPGA products.

This approach results in an extremely thin package height of less than 0.5mm (counting solder ball) that is ideal for applications where space is at a premium, such as sensor applications, small form-factor industrial equipment, and portable electronics. Other benefits comprise a better than 200 percent improvement in board-level reliability contrast to standard WLCSP, while enabling a large die size envelope and high package I/O count, targeting applications such as wireless LAN (WLAN) and power administration ICs (PMIC). Copper routing capability and inductor performance are also improved as a result of this breakthrough.

Taiwan Semiconductor Manufacturing Corporation Limited engages in the computer-aided design, manufacture, packaging, testing, sale, and marketing of integrated circuits and other semiconductor devices.

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